会社のニュース Mold and Gate Design Guidelines for PC Processing

  For PC processing, typical mold temperatures are 80–100°C (up to 100–130°C for glass-filled grades). Gate design includes pin gates for small parts, with depth around 70% of wall thickness; ring or rectangular gates are also used. Larger gates help minimize shear-induced defects. Vent depths should be under 0.03–0.06 mm, and runners kept short and rounded. Draft angles of 30 minutes to 1 degree aid release. Melt temperatures generally range 270–320°C (lower for some modified PCs). Injection speeds vary, often starting slow then accelerating. Back pressure around 10 bar is standard, adjustable for ventilation or mixing. Prolonged high-temperature residence can cause degradation and yellowing; use PS for barrel purging, avoiding LDPE, POM, ABS, or PA. Common product grades include filled or modified PA, PBT, POM, PPS, TPU, PEI, PEEK, ABS, PC, PP, and PMMA.